LAM RESEARCH CORPORATION

Lam’s TCP 9400DFM is an advanced silicon etch system for 200mm wafers, designed to meet gate and STI etch requirements down to the 130nm technology node. It is capable of running multiple applications in situ, increasing process flexibility, reliability, and productivity. The system features SymFlo™, a symmetrical flow gas distribution system, and Voltage Control Interface™ (VCI™), a closed-loop system that enhances chamber matching capabilities. It also incorporates Lam’s unique Waferless Auto Clean™ (WAC™) technology, which offers world-class mean time between cleans (MTBC). An optional interferometric endpoint system provides repeatable endpoint capability. The TCP 9400DFM offers upgrade capability for Lam’s highly successful TCP 9400PTX.

TCP 9400DFM

╬ó╨┼═╝╞¼_20240422181010.jpg

╬ó╨┼═╝╞¼_20240422181002.jpg

╬ó╨┼═╝╞¼_20240422180948.jpg

╬ó╨┼═╝╞¼_20240422180953.jpg

╬ó╨┼═╝╞¼_20240422180958.jpg

╬ó╨┼═╝╞¼_20240422181006.jpg

╬ó╨┼═╝╞¼_20240422181015.jpg

╬ó╨┼═╝╞¼_20240422181018.jpg

╬ó╨┼═╝╞¼_20240422181022.jpg

╬ó╨┼═╝╞¼_20240422180937.jpg

╬ó╨┼═╝╞¼_20240422180943.jpg

╬ó╨┼═╝╞¼_20240422180920.jpg

LAM RESEARCH CORPORATION

TCP 9400DFM

Dry / Plasma Etch

유사 등재물

LAM RESEARCH CORPORATION

TCP 9400DFM

LAM RESEARCH CORPORATION

TCP 9400DFM

TCP 9400DFM

Dry / Plasma Etch

유사 등재물

LAM RESEARCH CORPORATION

TCP 9400DFM

LAM RESEARCH CORPORATION

TCP 9400DFM