메인 콘텐츠로 건너뛰기

CELLESTA-i

카테고리
Wet Etch
개요

CELLESTA™ -i for 300mm wafer surface clean processing system provides enhanced productivity and significantly decreased footprint. The system incorporates up to twenty units of cleaning chambers and has much smaller footprint. Furthermore, it is equipped with integrated chemical recycle technology contributing less CoO, physical cleaning function for the particle removal on wafers; all of these functions contribute to achieve higher productivity. Additionally, this platform has excellent system extendibility, which is able to equip advanced bevel clean unit dedicated to wafer periphery and backside clean unit with less chemical consumption. 300mm wafer cleaning system, wet etch, uses hot IPA dry, can hold up to 20 cleaning chambers, 1000 wph throughput, can have bevel clean unit.

활성 등재물

2

서비스

검사, 보험, 감정, 물류

상위 등재물

이런 제품이 있으신가요?
Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.