설명
Oxide환경 설정
OxideOEM 모델 설명
UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools. Unity ME was originally made in Mass. But moved to Japan, supported 3 chambers and an ash or other small unit. Originally 200mm, some were converted to 300mm. TEL now manufactures this system again for 100-300mm.문서
문서 없음
TEL / TOKYO ELECTRON
UNITY ME
검증됨
카테고리
Plasma Etch
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56168
웨이퍼 사이즈:
8"/200mm
빈티지:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
UNITY ME
검증됨
카테고리
Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56168
웨이퍼 사이즈:
8"/200mm
빈티지:
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Oxide환경 설정
OxideOEM 모델 설명
UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools. Unity ME was originally made in Mass. But moved to Japan, supported 3 chambers and an ash or other small unit. Originally 200mm, some were converted to 300mm. TEL now manufactures this system again for 100-300mm.문서
문서 없음