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설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Datacon 8800 FC Quantum is a state-of-the-art flip chip platform designed to meet the challenges of modern flip chip production and future demands, offering user-friendly operation. This dedicated flip chip system provides a high-volume production solution with a perfect balance of precision and flexibility. With its advanced design, the 8800 FC Quantum can achieve an impressive throughput of up to 10,000 units per hour (UPH) without compromising process stability and reliability. FlipChip Bonder문서
문서 없음
카테고리
Flip Chip Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106834
웨이퍼 사이즈:
알 수 없음
빈티지:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / DATACON
8800 FC QUANTUM
카테고리
Flip Chip Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106834
웨이퍼 사이즈:
알 수 없음
빈티지:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Datacon 8800 FC Quantum is a state-of-the-art flip chip platform designed to meet the challenges of modern flip chip production and future demands, offering user-friendly operation. This dedicated flip chip system provides a high-volume production solution with a perfect balance of precision and flexibility. With its advanced design, the 8800 FC Quantum can achieve an impressive throughput of up to 10,000 units per hour (UPH) without compromising process stability and reliability. FlipChip Bonder문서
문서 없음