TFC-1000M
개요
Full-automated flip chip bonder for BGA/CSP, for 300mm wafers
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
- 제품을 찾을 수 없음
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Messages
Messages
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6" Fab For Sale from Moov - Click Here to Learn More
