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TEL / TOKYO ELECTRON TELFORMULA
  • TEL / TOKYO ELECTRON TELFORMULA
  • TEL / TOKYO ELECTRON TELFORMULA
  • TEL / TOKYO ELECTRON TELFORMULA
  • TEL / TOKYO ELECTRON TELFORMULA
  • TEL / TOKYO ELECTRON TELFORMULA
설명
FURNACE
환경 설정
Teos
OEM 모델 설명
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.
문서

문서 없음

TEL / TOKYO ELECTRON

TELFORMULA

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검증됨

카테고리
Furnaces / Diffusion

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

52004


웨이퍼 사이즈:

12"/300mm


빈티지:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기

TEL / TOKYO ELECTRON

TELFORMULA

verified-listing-icon
검증됨
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
listing-photo-4c6966da34664a3d86f83880fa558e56-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/4c6966da34664a3d86f83880fa558e56/c6ddb554def24c0a8977f564a1035478_fileutil3_mw.jpg
listing-photo-4c6966da34664a3d86f83880fa558e56-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/4c6966da34664a3d86f83880fa558e56/fe6e5fd1dfd848edb72c97ef93d497db_fileutil4_mw.jpg
listing-photo-4c6966da34664a3d86f83880fa558e56-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/4c6966da34664a3d86f83880fa558e56/1dd3c63269024cedad83cafa13fddc1a_fileutil_mw.jpg
listing-photo-4c6966da34664a3d86f83880fa558e56-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/4c6966da34664a3d86f83880fa558e56/1491e1ac47d04865aa52ccf1a82273b7_fileutil1_mw.jpg
listing-photo-4c6966da34664a3d86f83880fa558e56-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/4c6966da34664a3d86f83880fa558e56/232d0a414a4f4f18acb101e29c2ccdd4_fileutil2_mw.jpg
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

52004


웨이퍼 사이즈:

12"/300mm


빈티지:

2005


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
FURNACE
환경 설정
Teos
OEM 모델 설명
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.
문서

문서 없음

유사 등재물
모두 보기