설명
Tool is still running production.환경 설정
Gas Configuration Gas Type BF3 : SDS PH3 : SDS AsH3 : SDS External Facilities Connections : Ar | N2 Loading Configuration: SMIF Electrical Requirements : 208V / 250A GEM/SECS Interface : Yes SECS II Interface : Yes Energy Range : 80KeV Through Wafer – Wafer on Blade Sensor : Yes Hollow Gripper : Yes PEEK Moving Clips : Yes Ion Source Type : Bernas Plasma Flood System : Standard Source Material Type : Tungsten Arc Chamber Front Plate : Split Graphite Dual Vaporizers : No Post-Acceleration Tube/Turbo Pump : Leybold Process Chamber/Cryopumps : CTI OB10OEM 모델 설명
The Precision Implant xR80 was introduced in October 1995. It features low-energy and a very small system footprint while maintaining high throughput.문서
문서 없음
APPLIED MATERIALS (AMAT)
xR80
검증됨
카테고리
High Current
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
16512
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기APPLIED MATERIALS (AMAT)
xR80
검증됨
카테고리
High Current
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
16512
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Tool is still running production.환경 설정
Gas Configuration Gas Type BF3 : SDS PH3 : SDS AsH3 : SDS External Facilities Connections : Ar | N2 Loading Configuration: SMIF Electrical Requirements : 208V / 250A GEM/SECS Interface : Yes SECS II Interface : Yes Energy Range : 80KeV Through Wafer – Wafer on Blade Sensor : Yes Hollow Gripper : Yes PEEK Moving Clips : Yes Ion Source Type : Bernas Plasma Flood System : Standard Source Material Type : Tungsten Arc Chamber Front Plate : Split Graphite Dual Vaporizers : No Post-Acceleration Tube/Turbo Pump : Leybold Process Chamber/Cryopumps : CTI OB10OEM 모델 설명
The Precision Implant xR80 was introduced in October 1995. It features low-energy and a very small system footprint while maintaining high throughput.문서
문서 없음