설명
Lithography Lithography Machine환경 설정
환경 설정 없음OEM 모델 설명
"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy. Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."문서
문서 없음
EVGroup (EVG)
IQ ALIGNER
검증됨
카테고리
Mask/Bond Aligners
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115769
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
IQ ALIGNER
카테고리
Mask/Bond Aligners
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115769
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Lithography Lithography Machine환경 설정
환경 설정 없음OEM 모델 설명
"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy. Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."문서
문서 없음