6034
카테고리
Metrology개요
The Model 6034 measures wafer Thickness, Total Thickness Variation (TTV), Flatness, Bow and Warp. This system incorporates a similar capacitive measurement technique as the 6033T and is typically used in quality control and wafer processing areas to measure wafers up to 200mm in diameter.
활성 등재물
1
서비스
검사, 보험, 감정, 물류