UltraMap-TSV
카테고리
Metrology개요
The MicroSense UltraMap-TSV (Through Silicon Via) system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer—up to 300mm in diameter.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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