The MicroSense UltraMap-TSV (Through Silicon Via) system is the world’s first fully automated TSV and deep trench metrology system capable of characterizing TSV and deep trench features from both the front and back sides of the wafer—up to 300mm in diameter.

MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

UltraMap-TSV

카테고리

개요

활성 등재물

서비스

상위 등재물

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.