설명
설명 없음환경 설정
Tool is currently still in production. Tool is in good condition. Inspect to confirm configuration and condition. <b>C2 Dual Sequel Shrink</b> Electrical Requirements: 208 VAC, 3 phase, 5-wire Wafer Size (inches) : 8 Wafer Type : Notch Stand Alone Install RF Generator Rack SSD Serial Numbers: Module A : DCVD Serial Number : 01-8-C26291 Module B : DCV2 Serial Number : 01-12-C26315 DLCM Serial Number : 02-15-C26440 <b>DLCM</b> Signal Lamp Tower IOC Version : 4.2 Integrated SMIF SMIF Loader Make/Model : Asyst SMIF, LPI 2200 MAG 7 Robot Type SECS / GEMS <b>Sequel Chambers </b> Process Type : AHM Digital Dynamics IOC Heated Valves Gate Valve Mfg & Model : Gate Valve Assy, Heated 4 Inch. Novellus RF Match Type : A.E. End Point Detector RF Generators Advanced Energy RFG5500 Advanced Energy PDX1400 <b>Pumps </b> Deposition Chamber Pump: Alcatel ADS 1202P Load Lock Pump: Alcatel A100L Transfer Chamber Pump: Alcatel A100L <b>Gas Box Configuration</b> Gas Line # Gas Flow (sccm) MFC Mfgr. MFC Model 1 SiH4 750 Horiba Z512 2 N2 10000 Unit UFC1661 3 C2H2 5000 Horiba Z512 4 He 10000 Unit UFC1661 5 NH3 8000 Unit UFC1661 6 He 10000 Unit UFC1661 7 O2 15000 Unit UFC1661 8 NF3 2000 Unit UFC1661 9 N2O 20000 Unit UFC1661 10 N2 15000 Unit UFC1661OEM 모델 설명
The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.문서
문서 없음
LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2" DUAL SEQUEL
검증됨
카테고리
MOCVD
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
18871
웨이퍼 사이즈:
8"/200mm
빈티지:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기유사 등재물 없음
LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2" DUAL SEQUEL
검증됨
카테고리
MOCVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
18871
웨이퍼 사이즈:
8"/200mm
빈티지:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Tool is currently still in production. Tool is in good condition. Inspect to confirm configuration and condition. <b>C2 Dual Sequel Shrink</b> Electrical Requirements: 208 VAC, 3 phase, 5-wire Wafer Size (inches) : 8 Wafer Type : Notch Stand Alone Install RF Generator Rack SSD Serial Numbers: Module A : DCVD Serial Number : 01-8-C26291 Module B : DCV2 Serial Number : 01-12-C26315 DLCM Serial Number : 02-15-C26440 <b>DLCM</b> Signal Lamp Tower IOC Version : 4.2 Integrated SMIF SMIF Loader Make/Model : Asyst SMIF, LPI 2200 MAG 7 Robot Type SECS / GEMS <b>Sequel Chambers </b> Process Type : AHM Digital Dynamics IOC Heated Valves Gate Valve Mfg & Model : Gate Valve Assy, Heated 4 Inch. Novellus RF Match Type : A.E. End Point Detector RF Generators Advanced Energy RFG5500 Advanced Energy PDX1400 <b>Pumps </b> Deposition Chamber Pump: Alcatel ADS 1202P Load Lock Pump: Alcatel A100L Transfer Chamber Pump: Alcatel A100L <b>Gas Box Configuration</b> Gas Line # Gas Flow (sccm) MFC Mfgr. MFC Model 1 SiH4 750 Horiba Z512 2 N2 10000 Unit UFC1661 3 C2H2 5000 Horiba Z512 4 He 10000 Unit UFC1661 5 NH3 8000 Unit UFC1661 6 He 10000 Unit UFC1661 7 O2 15000 Unit UFC1661 8 NF3 2000 Unit UFC1661 9 N2O 20000 Unit UFC1661 10 N2 15000 Unit UFC1661OEM 모델 설명
The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.문서
문서 없음
유사 등재물
모두 보기유사 등재물 없음