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WCM-330
카테고리
Packaging개요
FOWLP/FIWLP/eWLB compatible, high precision, high quality, fully automatic molding system High precision platen parallelism by adopting 4-axis linear motion motor Equipped with a high-pressure 85-ton press that enables MUF molding technology Both liquid and granular resin can be supplied. Abundant optional functions such as chip counting, visual inspection, post-curing, IP camera, etc. SEMI S2 compliant, SEMI S8/CE optional FOWLP: Fan-Out Wafer Level Package FIWLP: Fan-In Wafer Level Package EWLP: Embedded Wafer Level Package
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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