Besi Netherlands B.V. develops and manufactures machines for the semiconductor industry under the brand name Fico. This includes molding systems, trim & form equipment, laser markers, and singulation systems for leadframe and array connect substrates.

BESI / FICO

AMS 36

AMS M

The new Fico Compact Line - X (FCL-X) is the latest development in Trimming & Forming and can process extreme high density leadframes up to 125 x 300 mm. The FCL-X is the answer to the increasing accuracy and Cpk demands. The FCL-X press has an increased press force to process extreme high density leadframes. Its advanced pollution control system allows trouble free processing of preplated and interdigit leadframes. Each press has dedicated aspiration, with controlled high air flow speeds and a unique cyclone dust filter. A range of loader and offloader modules are available, ranging from magazines and cassettes to tray, bulk and tube. Short and controlled transport distances increase the performance of the FCL-X and at the same time prevent damage to your products.

FCL-X

AMS 24

The Fico MMS-i is a single press, manual version of the Fico AMS-i automatic molding system. It was especially developed for molding process parameter optimization. By making use of test molds, new products can be developed and optimized prior to large scale production. Besides that, the Fico MMS-i can be used for small production batches or offline cleaning of the molds that are used in the Fico AMS-i.

MMS-i

The BESI FICO AMS 36M is a molding system used in the semiconductor industry for molding semiconductor devices

AMS 36M

The Fico MMS-LM for top foil is the manual version of the AMS-LM, automatic molding system. It can be used for single sided products in MAP, such as BGA or QFN. Top foil allows bleed free production of bare die products.A special foil, guided over the top mold, creates a soft sealing layer between the top mold and the products which eliminates an extra cleaning process step after molding.

MMS-LM Top Foil

The Fico MMS-LM is a molding system for single sided products in MAP, such as BGA, QFN etc. The machine was especially developed for molding process parameter optimization. By making use of the original molds, new products can be developed and optimized prior to large scale production. Besides that, the Fico MMS-LM can be used for small production batches or offline cleaning of the molds that are used in the Fico AMS-LM.

MMS-LM

AMS SM

The new Fico Compact Line - P (FCL-P) is the latest development in Trimming & Forming for power products. The FCL-P is the answer to the increasing demands on accuracy, Cpk and product traceability. The FCL-P press has an advanced pollution control system that allows trouble free processing of preplated and interdigit leadframes. Each press has dedicated aspiration, with controlled high air flow speeds and a unique cyclone dust filter. A range of loader and offloader modules are available, ranging from magazines and cassettes to tray, bulk and tube. Short and controlled transport distances increase the performance of the FCL-P and at the same time prevent damage to your products.

FCL-P

AMS 24M

AMS-11-MR2	

MMS-12-M

Fico Sawing Line (FSL), Besi initiates yet another era in singulation. Singulation is a 4 step process where - from a large strip - individual products are sawn, cleaned, inspected and sorted. In the Fico Sawing Line, Besi has integrated all these process steps into one single machine. With its compact size the FSL has the highest output per square meter. The FSL carries out all process steps simultaneously using reliable vacuum on each single product, instead of tape. The unique and patented sawing method has the best scrap handling in the market and an unsurpassed accuracy. 100% inspection ensures that only perfect products leave the machine. With the FSL, singulation is elevated to an art, the art of singulation.

In line with the market trend of larger substrates, Besi Netherlands has introduced a new large substrate molding machine with Top Foil functionality, to mold single sided MAP products like BGA, QFN and BOC. The unique Top Foil feature on this machine allows bleed free production of bare die products. Top Foil: A special foil, guided over the top mold, creates a soft sealing layer between mold and products. As a result, the die stays clear of compound. The use of top foil eliminates an extra cleaning process step after molding. The Fico AMS-LM Top Foil can handle substrates of up to 102 x 280 mm and can handle all current single sided packages.

AMS-LM Top Foil

Molding is a process where micro chips are encapsulated in plastic. In line with the market trend toward SIP, exposed dies and more complex packages like dual side molding, Besi developed the large substrate molding machine Fico AMS-LM. The Fico AMS-LM can handle substrates of up to 102 x 280mm and can handle all current single and dual sided packages.

Large substrates allow a high board utilisation and in combination with deep vacuum, the unique clamp mechanism and the high output of the Fico AMS-LM, performance and yield increase significantly.

AMS-LM

Besi has reinvented leadframe molding with its new Fico AMS-X. The increased market demand for power products and higher densities on larger leadframes asked for a new solution. With the new Fico AMS-X Besi has set a new benchmark in leadframe molding. The new Fico AMS-X has newly developed plate presses. An extremely compact and rigid construction. To obtain a bleed free end product, each press has 4 clamp modules that ensure a high and even clamp force all around the product.
And with its new UX-design, the Fico AMS-X is the most user friendly Fico molding system ever. 

AMS-X

MMS-i60-102

The Fico Compact Line (FCL) Trim & Form line, is an ultra-flexible platform for leadframe based discretes, ICs, Mems and power packages. The FCL is developed for a frame width of 100 mm so it can handle any newly designed high density leadframe. Its unique wheel transport in combination with horizontal offloading makes the FCL suited for any kind of leadframe.

AMS W

The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.

AMS-W40-306

ASM-36-M2

AMSI 204

The Fico MMS-X is perfectly suited for molding process parameter optimization, small production batches or offline mold cleaning. It is ideal for low cost product development and to determine the process window for your product. Optimized parameters can easily be copied to the Fico AMS-X, automatic molding system, for large scale production. Original Fico molds can be used on both the Fico MMS-X as well as on the Fico AMS-X.

MMS-X

The Fico AMS-i is a fully automatic molding system. It is designed for all current and future package types, using any type of pelletized molding compound. Independent, flexible press operation, high reliability and the shortest machine time in the market, guarantee high output. The flexible design allows easy incorporation of your specific requirements. Intelligent mold identification, which automatically loads process parameters, ensures quick start-up and ease of operation.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

BESI / FICO

개요

활성 등재물

총 제품 수

서비스

상위 BESI / FICO Packaging

MMS-i

AMS-LM

AMS-LM Top Foil

MMS-LM Top Foil

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모든 BESI / FICO Packaging