APAMA C2W
카테고리
Packaging개요
Advanced packaging, thermo-compression for chip-to-wafer, high accuracy flip chip ("HA FC") and high density fan-out wafer level packaging ("HD FOWLP") bonding applications.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
- 제품을 찾을 수 없음
Advanced packaging, thermo-compression for chip-to-wafer, high accuracy flip chip ("HA FC") and high density fan-out wafer level packaging ("HD FOWLP") bonding applications.
0
검사, 보험, 감정, 물류