RAD-3520 F/12
카테고리
Packaging개요
A tape laminator to protect the circuit surface of the wafer during the back grinding and thinning process of the semiconductor wafer after circuit formation.
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0
서비스
검사, 보험, 감정, 물류
상위 등재물
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A tape laminator to protect the circuit surface of the wafer during the back grinding and thinning process of the semiconductor wafer after circuit formation.
0
검사, 보험, 감정, 물류