설명
설명 없음환경 설정
Scientific Sealing Technology HV-2200-GT High Vacuum Thermal DAP Package Sealer. The HI VAC-2200 GT system is used for soldering, brazing or glass sealing of components requiring low residual gas environment or low moisture content. The system also has the capability of providing for a high vacuum, in-process bake for the removal of contaminating volatiles prior to backfilling with the controlled atmospheres of your choice. 220V, 1 Ph, 50/60 Hz, 100A. Typical Applications: Package sealing requiring controlled internal environment. Void free, flux free soldering for die attach, MCM assembly, power components and flip chip attach. Glass fusion and glass to metal sealing. Field emission flat panel display assembly. Glass to silicon, silicon to silicon wafer bonding. System Features: User friendly menu driven programming. Precise control of temperature (up to 1000 deg C), heating rates, dwell times and cooling rates.OEM 모델 설명
High Vacuum Sealing문서
문서 없음
SCIENTIFIC SEALING TECHNOLOGY / SST
HV-2200-GT
검증됨
카테고리
Packaging
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
22932
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기유사 등재물 없음
SCIENTIFIC SEALING TECHNOLOGY / SST
HV-2200-GT
검증됨
카테고리
Packaging
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
22932
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Scientific Sealing Technology HV-2200-GT High Vacuum Thermal DAP Package Sealer. The HI VAC-2200 GT system is used for soldering, brazing or glass sealing of components requiring low residual gas environment or low moisture content. The system also has the capability of providing for a high vacuum, in-process bake for the removal of contaminating volatiles prior to backfilling with the controlled atmospheres of your choice. 220V, 1 Ph, 50/60 Hz, 100A. Typical Applications: Package sealing requiring controlled internal environment. Void free, flux free soldering for die attach, MCM assembly, power components and flip chip attach. Glass fusion and glass to metal sealing. Field emission flat panel display assembly. Glass to silicon, silicon to silicon wafer bonding. System Features: User friendly menu driven programming. Precise control of temperature (up to 1000 deg C), heating rates, dwell times and cooling rates.OEM 모델 설명
High Vacuum Sealing문서
문서 없음
유사 등재물
모두 보기유사 등재물 없음