설명
Pasting machine환경 설정
환경 설정 없음OEM 모델 설명
-Handles wafer diameters up to 200mm(8 inch) -H.D.C.R(Highly Digital Control Recipe) Availlable -Running Thin Wafer/ High Bump Wafer Capabity . -The New Wafer Mounter orients a wafer on a dicing frame automatically. -A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer. -This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.문서
문서 없음
TEIKOKU
ATM-800X
검증됨
카테고리
Packaging
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
94157
웨이퍼 사이즈:
알 수 없음
빈티지:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기유사 등재물 없음
TEIKOKU
ATM-800X
카테고리
Packaging
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
94157
웨이퍼 사이즈:
알 수 없음
빈티지:
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Pasting machine환경 설정
환경 설정 없음OEM 모델 설명
-Handles wafer diameters up to 200mm(8 inch) -H.D.C.R(Highly Digital Control Recipe) Availlable -Running Thin Wafer/ High Bump Wafer Capabity . -The New Wafer Mounter orients a wafer on a dicing frame automatically. -A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer. -This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.문서
문서 없음
유사 등재물
모두 보기유사 등재물 없음