TOWA

YPS1120

Y1E-2080

Y1-E

The Towa FFT 1030W molding system uses liquid resin (Silicone) and is perfect for small volume and various package type production. It has achieved uniform, stable lens shape, and high precision molding. It is available with 1 or 2 liquid type optional dispenser unit. 

FFT 1030W

Features:
- TOWA's proprietary compression molding method using granular resin
- Full automatic equipment suitable for multi-product variable production
- Corresponding to the wafer level molding (manual system)
- Environmentally friendly equipment that generates no waste

FFT1030G

PMC1040-D

Y1E-2060

The TOWA CCS30 is a packaging machine. The press module offers superior space performance, with a width of only 40 cm. The CC-S supports the full range of leadframes, from standard size leadframes all the way up to ultra-wide leadframes.

CCS30

Y1E-2120

FFT 1005

UPS 120N-EX

The highly popular Y1R/Y1E-series are transfer type molding equipment that has been a long-time seller. The Y-series equipment was developed in 1992 and permits the press modules to be detached in accordance with the production quantity. 

FFT1030L

TOWA LCM 1010 is a compression molding equipment that is optimal for high-volume production of LED packages. It uses TOWA’s proprietary compression molding method and is capable of molding resins containing phosphor, 8-inch wafers and large frame100 mm X 300 mm. It is a semi-auto equipment suitable for high-volume production of LED packages

LCM 1010

Y1R1080

KPS-60V

Features:
- Transfer molding equipment with proven high reliability and stability for many years
- The number of press modules can be changed, enabling the equipment to respond to changes in production quantity
- Clamp ability of 60 tons

Y1R1060

YPM1180

FMS3040

The TOWA Y120 is the best selling model for Semiconductor Molding System which incorporates Towa original Modular System. It has an electro-mechanical press that provides a clean operating environment and improves productivity through shortened machine cycle time. It has a capability to attach FM system for ultra-high quality molding and has a 120-ton press. Electricity consumption is reduced by 50% compared with former conventional molding systems.

Y120

YPSI

YPS2060

YPS60V

Compression Molding Equipment

Features:
- Advanced high accuracy press improves package thickness accuracy.
- Reinforce contamination-prevention measures by improving environment inside machine
- Improvement of productivity by high UPH
- Integration of TOWA's proprietary compression technologies with a modular method
- Double-layer structure
- Compatible with large 100mm X 300mm workpieces
- Capable of molding large frames/substrates in bulk

PMC2030-D

The YPS 120T is a modular molding system that offers high productivity and proven reliability for molding various types of semiconductor packages. It is capable of reflector molding for LED application. This system is a significantly upgraded version of the world best selling Towa “Y series

TOWA

개요

활성 등재물

총 제품 수

서비스

상위 TOWA Packaging

YPS1120

Y1E-2080

FFT 1030W

PMC1040-D

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.

모든 TOWA Packaging