We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기
DFM2700
개요
The DISCO DFM2700 is a wafer mounter designed for semiconductor manufacturing. It automates the process of attaching wafers to dicing tape or tape frames and removing front-side protective tape. This equipment is particularly suitable for processing ultra-thin wafers, including those less than 25 μm thick, and is often integrated into inline systems with backgrinders like the DGP8760.
활성 등재물
1
서비스
검사, 보험, 감정, 물류
