Lam Research is a leading supplier of plasma etch- and single-wafer clean equipment that plays a pivotal role in defining the features and capabilities of next-generation semiconductor devices. With the addition of Novellus' innovative thin-film deposition and surface preparation product lines, the new Lam Research is well-positioned within the industry to support critical technology transitions including 3D structures in advanced logic and NAND memory, as well as the scaling to 450 mm wafers.

The VECTOR Excel is a modular system designed to address the needs of advanced technology nodes that require pre- or post-deposition treatment of the dielectric film.

LAM RESEARCH / NOVELLUS

VECTOR EXCEL

In 1995, the Company introduced  an extension to its Concept One-Dielectric system, the Concept One Maxus. The Maxus extends the Company's leadership in nitride passivation by enhancing the nitride deposition rate while retaining superior nitride film performance. It also enhances the gap fill capability of TEOS films by enabling fluorinated-TEOS (F-TEOS) processing for .35 micron gap fill. F-TEOS enables the customer to lower the dielectric constant to 3.7, an important capability in enhancing device performance. The Maxus is available on both the Concept One and Concept Two platform.

CONCEPT ONE "C1" MAXUS

CONCEPT ONE-DIELECTRIC
The Concept One-Dielectric is shipped in two versions, the Concept One-150, which processes 100, 125, and 150 mm (approximately 4, 5, and 6 inches) wafers and the Concept One-200, which processes 125, 150 and 200 mm (approximately 5, 6 and 8 inches) wafers and is designed for advanced eight inch fabrication lines.

CONCEPT ONE-150

 The SPEED NExT system for 300 mm wafers is designed specifically to address the challenges of dielectric gap fill at 65 nm and beyond. SPEED NExT builds upon the superior high conductance chamber design of the existing SPEED platform with an innovative source technology that enables repeatable gap fill across a 300-mm wafer. In addition, the ability to control the wafer position relative to the source allows SPEED NExT to have a wider gap fill process window.

CONCEPT THREE "C3" SPEED NExT

VECTOR DT provides a single-step solution for wafer shape management by depositing a tunable counter-stress film on the back of the wafer without contacting the front side, thereby enabling improved lithography results, reduced bow-induced failures, and integration of high performance but highly stressed films. With strong customer adoption since its debut, the VECTOR DT installed base continues to grow as customers are transitioning to more than 96 layers.

VECTOR DT

 VECTOR Extreme can also be configured to deposit ashable hard mask (“AHM”) films.

VECTOR Extreme AHM

CONCEPT ONE-200

The VECTOR Extreme TEOS xT version runs at industry leading throughputs.

VECTOR Extreme TEOS xT

Used to deposit high quality dielectric liners for TSV structures, as well as other low temperature films such as silicon nitride and silicon oxide that are compatible with bonded substrates. The system incorporates technology to tune the hermiticity and electrical performance of these low temperature films to match the film quality typically obtained with a higher temperature dielectric deposition. VECTOR 3D also uses the same patented MSSD technology that’s incorporated into the more than 1,000 VECTOR PECVD systems that have been shipped worldwide.

VECTOR 3D

VECTOR Q Strata is a product in the VECTOR family of Lam Research Corporation. It is designed to provide the performance and flexibility needed to create enabling structures and meet the demands of challenging applications in the semiconductor industry. The VECTOR family uses Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Plasma-Enhanced Atomic Layer Deposition (ALD) technologies to deposit high-quality dielectric films that meet exacting thickness, feature coverage, and stress, electrical, and mechanical requirements. The VECTOR Q Strata offers superior thin film quality, exceptional wafer-to-wafer uniformity, best-in-class productivity, low cost of ownership, and broad process flexibility enabled by Multi-Station Sequential Deposition (MSSD) architecture. It also features proprietary technology for controlling wafer heat-up independent of film deposition, improving film quality and reducing processing time.

VECTOR Q STRATA

The Novellus Concept-One is a PECVD tool that uses plasma-enhanced chemical vapor deposition to deposit various dielectric films on silicon wafers. It can deposit oxide, nitride, oxynitride, PSG and TEOS oxide films. The Concept1 is also a PECVD tool that deposits dielectric films on 6" wafers. It is capable of depositing thick films in excess of 1 um and allows CMOS compatible metals, making it suitable for backend processes. The system deposits on multiple wafers in parallel in a batch-type reactor.

CONCEPT ONE "C1"

Novellus VECTOR Express is an improvement to Novellus’ 300 mm VECTOR plasma-enhanced chemical vapor deposition (PECVD) platform that was introduced in 2007. It maintains industry-leading capital and footprint productivity by improving process throughput by up to 40%, while delivering benchmark thin film process performance that is critical to tool extendibility to 45 nm and beyond.

The SmartSoak processing feature is incorporated in VECTOR Express which utilizes the multi-station sequential processing (MSSP) architecture of VECTOR to control wafer heat-up independently from film deposition, improving film quality and reducing processing time .

VECTOR Express is also available in an ashable hard mask configuration (VECTOR Express AHM), designed to deposit films for the high aspect ratio patterning requirements required by 193 nm lithography.

VECTOR EXPRESS 

VECTOR is a PECVD system for dielectric films that radically transforms the playing field in terms of capital productivity. A
200mm/300mm bridge tool, VECTOR is designed to deliver a fully integrated low-k dielectric structure at 0.10 micron and smaller design rules. VECTOR is designed for high reliability, with 40% fewer critical subassemblies than the nearest
competitor. With approximately 2/3rds the footprint of the nearest competitor, and a throughput of 120 wafers per hour. 

VECTOR

VECTOR EXPRESS AHM

The Novellus Concept Three Speed is an advanced system designed for 300 mm wafers, boasting a proprietary hemispherical ion source and bi-polar electrostatic chuck. These innovative features ensure superior ion uniformity and precise temperature control. Even as the elements are scaled up for 300 mm wafers, the ion uniformity remains consistent due to the inherent design characteristics of the ion source. Additionally, an optimized gas delivery system enhances the overall within-wafer uniformity, further improving the system's performance.

CONCEPT THREE "C3" SPEED

The Novellus VECTOR Extreme is an advanced 300mm Plasma-Enhanced Chemical Vapor Deposition (PECVD) system designed for memory fabs requiring exceptional throughput. It processes up to 250 wafers-per-hour and features a central wafer process chamber with a dual handling robot, allowing integration of up to three PECVD process modules on a single system. Utilizing Novellus' multi-station sequential processing (MSSP) architecture, the VECTOR Extreme's process modules remain hardware-transparent with VECTOR Express, ensuring easy process integration across platforms. Additionally, the VECTOR Extreme offers an ashable hard mask configuration, known as VECTOR Extreme AHM, catering to specific processing needs.

VECTOR  EXTREME

The Concept One-W deposits blanket tungsten metal films, which are increasingly used in advanced semiconductor devices to connect multiple metal layers in the integrated circuit.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

LAM RESEARCH / NOVELLUS

개요

활성 등재물

총 제품 수

서비스

상위 LAM RESEARCH / NOVELLUS PECVD

VECTOR EXCEL

VECTOR 3D

VECTOR Q STRATA

CONCEPT ONE "C1" MAXUS

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모든 LAM RESEARCH / NOVELLUS PECVD