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OXFORD PLASMALAB 100
  • OXFORD PLASMALAB 100
설명
Currently installed, but not operational (there is a wafer transport issue)
환경 설정
Oxford Plasmalab 100 PECVD configured for 200mm wafers, with Al carrier for multiple substrate sizes, down to small pieces. Used for deposition of silane oxides and nitrides, with optional low-frequency power supply.
OEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces
문서

문서 없음

카테고리
PECVD

마지막 검증일: 10일 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

106186


웨이퍼 사이즈:

8"/200mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

OXFORD

PLASMALAB 100

verified-listing-icon
검증됨
카테고리
PECVD
마지막 검증일: 10일 전
listing-photo-7c3cfb509292414388033e656930ee3a-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/48508/7c3cfb509292414388033e656930ee3a/dc6036ca710b4a98bcdcda2f1c249644_screenshot20250305at12_mw.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

106186


웨이퍼 사이즈:

8"/200mm


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Currently installed, but not operational (there is a wafer transport issue)
환경 설정
Oxford Plasmalab 100 PECVD configured for 200mm wafers, with Al carrier for multiple substrate sizes, down to small pieces. Used for deposition of silane oxides and nitrides, with optional low-frequency power supply.
OEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces
문서

문서 없음