설명
설명 없음환경 설정
Plasmalab 80 Plus RIE Etcher - Single Chamber RIE, non-load locked - Ideal for R&D reactive ion etch applications - Process: Dielectric etch and Descum - System setup with universal platen (with ability to place various size(s) of substrates). - Up to 200mm wafer capable - System PC, Keyboard, Mouse - RF Generator - Leybold Vacuum Pump - Neslab Chiller - Operations Manual and Documentation - Fully Refurbished to excellent condition - System Dimensions: 23 x 32 x 60 inches Gas Box: - N2 - Ar - O2 - SF6 - CHF3 PROCESS consists of: - Chamber disassembled for refurbishment. - Chamber received full wet clean. - Chamber o-rings and seals are replaced with brand new. - Electrostatic Chuck (ESC) sent out for refurbishment (if applicable - All MFCs rebuilt and calibrated professionally. - All corrosive gas lines replaced with brand new. - All Non-corrosive gas lines purged. - Vacuum pumps professionally rebuilt. - Turbo pump professionally rebuilt. - Chillers serviced and fully tested. - All wiring/wire harnesses are checked, repaired or replaced if needed. - All liquid and air lines, tubing and fittings checked and replaced if necessary - Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed. - Checkout of all electronic and mechanical parts. - Machine covers are cleaned, polished or replaced as needed. - Post-refurbishment system leak and RF calibration checks, with documentation provided to customer. - System cycle and repeatability testing completed prior to cover replacement and wipe down. - System components carefully packed, labeled, and professionally crated.OEM 모델 설명
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.문서
문서 없음
OXFORD
PLASMALAB 80 PLUS
검증됨
카테고리
PECVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
60108
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
OXFORD
PLASMALAB 80 PLUS
카테고리
PECVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
60108
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Plasmalab 80 Plus RIE Etcher - Single Chamber RIE, non-load locked - Ideal for R&D reactive ion etch applications - Process: Dielectric etch and Descum - System setup with universal platen (with ability to place various size(s) of substrates). - Up to 200mm wafer capable - System PC, Keyboard, Mouse - RF Generator - Leybold Vacuum Pump - Neslab Chiller - Operations Manual and Documentation - Fully Refurbished to excellent condition - System Dimensions: 23 x 32 x 60 inches Gas Box: - N2 - Ar - O2 - SF6 - CHF3 PROCESS consists of: - Chamber disassembled for refurbishment. - Chamber received full wet clean. - Chamber o-rings and seals are replaced with brand new. - Electrostatic Chuck (ESC) sent out for refurbishment (if applicable - All MFCs rebuilt and calibrated professionally. - All corrosive gas lines replaced with brand new. - All Non-corrosive gas lines purged. - Vacuum pumps professionally rebuilt. - Turbo pump professionally rebuilt. - Chillers serviced and fully tested. - All wiring/wire harnesses are checked, repaired or replaced if needed. - All liquid and air lines, tubing and fittings checked and replaced if necessary - Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed. - Checkout of all electronic and mechanical parts. - Machine covers are cleaned, polished or replaced as needed. - Post-refurbishment system leak and RF calibration checks, with documentation provided to customer. - System cycle and repeatability testing completed prior to cover replacement and wipe down. - System components carefully packed, labeled, and professionally crated.OEM 모델 설명
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.문서
문서 없음