설명
Silvia 2ch / Axiom 1ch환경 설정
Silvia 2ch / Axiom 1chOEM 모델 설명
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.문서
문서 없음
APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
검증됨
카테고리
Plasma Etch
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
75693
웨이퍼 사이즈:
12"/300mm
빈티지:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
검증됨
카테고리
Plasma Etch
마지막 검증일: 17일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
75693
웨이퍼 사이즈:
12"/300mm
빈티지:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Silvia 2ch / Axiom 1ch환경 설정
Silvia 2ch / Axiom 1chOEM 모델 설명
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.문서
문서 없음