설명
Disco DFG841 Back Grinder환경 설정
2 grind tables2 grind tablesOEM 모델 설명
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.문서
문서 없음
DISCO
DFG841
검증됨
카테고리
Polishing and Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
93124
웨이퍼 사이즈:
알 수 없음
빈티지:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기DISCO
DFG841
카테고리
Polishing and Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
93124
웨이퍼 사이즈:
알 수 없음
빈티지:
1997
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Disco DFG841 Back Grinder환경 설정
2 grind tables2 grind tablesOEM 모델 설명
The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.문서
문서 없음