설명
설명 없음환경 설정
Loader Port: 2 Ports Robot Arm: Dual (U Arm) Aligner: Position Table (12" & 13") Wafer Warpage: 4mm Spindle: Z1 & Z2 Spindle Height Guage: Wafer Thickness Check During Grinding Chuck Table: CHUCK A, B, C System: Win EmbeddedOEM 모델 설명
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.문서
문서 없음
DISCO
DFG8560
검증됨
카테고리
Polishing and Grinding
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
15188
웨이퍼 사이즈:
12"/300mm
빈티지:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기DISCO
DFG8560
검증됨
카테고리
Polishing and Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
15188
웨이퍼 사이즈:
12"/300mm
빈티지:
2016
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Loader Port: 2 Ports Robot Arm: Dual (U Arm) Aligner: Position Table (12" & 13") Wafer Warpage: 4mm Spindle: Z1 & Z2 Spindle Height Guage: Wafer Thickness Check During Grinding Chuck Table: CHUCK A, B, C System: Win EmbeddedOEM 모델 설명
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.문서
문서 없음