설명
설명 없음환경 설정
OCR: Yes Wafer specification Size: 8"/12" Thickness: 240~2200um Die size: 350~76000um Autoloader unit 300 mm FOUP/ FOSB and 200 mm cassette Interface Single port Loader GPIB Chuck Nickel plate Planarity: 15um (20°C≤t ≤50°C) 30um (50°C≤t ≤200°C) Temperature: 30°C to 150°C Withstand Load : 200kgf Display Unit: 15" color display & touch panel Cleaning Unit (100 mm x 60mm) 3 block with vacuum type APC function No Miscellaneous 1. Touch sensor. 2. Ethernet interface. 3. Cognex 8200 Auto hinge No Probe card holder No Touch sensor YesOEM 모델 설명
The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.문서
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
128849
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
ACCRETECH / TSK
UF3000EX-e
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
128849
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available