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UF300A
카테고리
Probers개요
The Wafer Probing Machine UF300A is a highly advanced equipment designed for wafer probing processes. It offers precise stage-positioning capabilities with an accuracy of 2 micro-meters and is compatible with wafers of ø 300 mm in size. The machine features a Z-theta stage that provides super-high rigidity, ensuring stability during probing operations.
활성 등재물
1
서비스
검사, 보험, 감정, 물류
