IP-300H
카테고리
Probers개요
Feature: Application for wafer size : 8”~12” Contact accuracy : ±1㎛ (Advanced motion control technology) Improvement of loading accuracy (Wafer change and align time reduction) Stiffness Z-axis (250 kgf) Application of auto leveling / securing the stability of contact (10㎛) Auto card change (Side auto card change)
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
- 제품을 찾을 수 없음