SEMPRO PRIME
카테고리
Probers개요
Feature: Application for wafer size : 8”~12” Contact accuracy: ±1㎛ (Advanced motion control technology) Improvement of Loading Accuracy (Wafer change and align time reduction) Stiffness Z-axis (1,000 kgf) Precision temperature control (4℃@2,000W) Application of auto leveling / securing the stability of contact (10㎛) Self-diagnosis system (Life prediction, Pre-detection) Auto card change (Side/front auto card change) Advanced wafer & card automation (RGV, OHT, AGV)
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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