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TEL P12XLn prober Dual foup VIP3OEM 모델 설명
The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).문서
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TEL / TOKYO ELECTRON
P-12XLn
검증됨
카테고리
Probers
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
74464
웨이퍼 사이즈:
12"/300mm
빈티지:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
P-12XLn
카테고리
Probers
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
74464
웨이퍼 사이즈:
12"/300mm
빈티지:
2003
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
TEL P12XLn prober Dual foup VIP3OEM 모델 설명
The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).문서
문서 없음