설명
설명 없음환경 설정
Process Wafer Testing Main System TEL P12 Prober 1 Handler System NA Factory Interface Open Cassette 1 Missing/Faulty Parts / Accesorries List -HDD Board 1 -Prober LCD screen 1 -VIP3A 1OEM 모델 설명
The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).문서
문서 없음
TEL / TOKYO ELECTRON
P-12XLn
검증됨
카테고리
Probers
마지막 검증일: 20일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106072
웨이퍼 사이즈:
12"/300mm
빈티지:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
P-12XLn
카테고리
Probers
마지막 검증일: 20일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106072
웨이퍼 사이즈:
12"/300mm
빈티지:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Process Wafer Testing Main System TEL P12 Prober 1 Handler System NA Factory Interface Open Cassette 1 Missing/Faulty Parts / Accesorries List -HDD Board 1 -Prober LCD screen 1 -VIP3A 1OEM 모델 설명
The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).문서
문서 없음