설명
설명 없음환경 설정
Model Precio CPU Main CPU Comm I/F GPIB SACC n/a Inker n/a Polisher n/a Chuck Type Hot (hot chuck but no temp controller) Temp.Ambient Chuck Ni OCR n/a Loader type TS1 Buffer Table Front Option - 1 USB no manipulators fully operational and onlineOEM 모델 설명
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.문서
문서 없음
TEL / TOKYO ELECTRON
PRECIO
검증됨
카테고리
Probers
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
18342
웨이퍼 사이즈:
알 수 없음
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
PRECIO
검증됨
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
18342
웨이퍼 사이즈:
알 수 없음
빈티지:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Model Precio CPU Main CPU Comm I/F GPIB SACC n/a Inker n/a Polisher n/a Chuck Type Hot (hot chuck but no temp controller) Temp.Ambient Chuck Ni OCR n/a Loader type TS1 Buffer Table Front Option - 1 USB no manipulators fully operational and onlineOEM 모델 설명
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.문서
문서 없음