설명
Production Wafer Prober환경 설정
환경 설정 없음OEM 모델 설명
There are an increasing variety of test requirements in conjunction with diversified device design, device application, process node shrink and package design complexity. To reduce total test cost, especially in Memory applications, multi-site probe cards were introduces as a way of reducing test cost. This method found its limit when single wafer/one-touch-down probe card technology appeared. Cellcia™ is a breakthrough technology. Splitting wafer lots into the Cellcia™ multi-cell probe system, reduces test turn-around-time and improves system footprint by adopting a multi-layer structure. Conventional prober technology cannot achieve the Cellcia™ throughput with similar floor space. The Cellcia™ system maximizes test efficiency and minimizes total test cost. TEL has combined its vast wafer probe experience and front-end process technologies to develop the world’s leading probe system, Cellcia™.문서
문서 없음
TEL / TOKYO ELECTRON
CELLCIA
검증됨
카테고리
Probers
마지막 검증일: 15일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
109606
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
CELLCIA
카테고리
Probers
마지막 검증일: 15일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
109606
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Production Wafer Prober환경 설정
환경 설정 없음OEM 모델 설명
There are an increasing variety of test requirements in conjunction with diversified device design, device application, process node shrink and package design complexity. To reduce total test cost, especially in Memory applications, multi-site probe cards were introduces as a way of reducing test cost. This method found its limit when single wafer/one-touch-down probe card technology appeared. Cellcia™ is a breakthrough technology. Splitting wafer lots into the Cellcia™ multi-cell probe system, reduces test turn-around-time and improves system footprint by adopting a multi-layer structure. Conventional prober technology cannot achieve the Cellcia™ throughput with similar floor space. The Cellcia™ system maximizes test efficiency and minimizes total test cost. TEL has combined its vast wafer probe experience and front-end process technologies to develop the world’s leading probe system, Cellcia™.문서
문서 없음