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TEL / TOKYO ELECTRON TRIASe+ W
    설명
    MOCVD
    환경 설정
    Triase+ SFD-W
    OEM 모델 설명
    Triase+™ W is a 300mm single-wafer CVD system that delivers high step coverage tungsten (W) film deposition using WF6. By combining rapid heat up and cool down of wafer temperatures and with plasma-less chamber cleaning technology, the system achieves higher productivity and lower CoO. Utilizing SFD and CVD methods respectively, the Triase+™ W provides in-situ deposition of both nucleation and bulk film. This ensures high step coverage, even with small geometry, contact holes. The system is also capable of depositing low-resistance film to meet further scaling needs, and is suitable for such applications as contact plug formation and via filling.
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    TEL / TOKYO ELECTRON

    TRIASe+ W

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    검증됨

    카테고리

    CVD (Metalization)
    마지막 검증일: 60일 이상 전
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    62724


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    알 수 없음

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    Money Back Guarantee
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    유사 등재물
    모두 보기

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    TEL / TOKYO ELECTRON

    TRIASe+ W

    verified-listing-icon

    검증됨

    카테고리

    CVD (Metalization)
    마지막 검증일: 60일 이상 전
    listing-photo-91f48ba1afa6449987f29f0701a707bd-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    62724


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    알 수 없음


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    MOCVD
    환경 설정
    Triase+ SFD-W
    OEM 모델 설명
    Triase+™ W is a 300mm single-wafer CVD system that delivers high step coverage tungsten (W) film deposition using WF6. By combining rapid heat up and cool down of wafer temperatures and with plasma-less chamber cleaning technology, the system achieves higher productivity and lower CoO. Utilizing SFD and CVD methods respectively, the Triase+™ W provides in-situ deposition of both nucleation and bulk film. This ensures high step coverage, even with small geometry, contact holes. The system is also capable of depositing low-resistance film to meet further scaling needs, and is suitable for such applications as contact plug formation and via filling.
    문서

    문서 없음

    유사 등재물
    모두 보기

    유사 등재물 없음