설명
설명 없음환경 설정
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM 모델 설명
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.문서
문서 없음
APPLIED MATERIALS (AMAT)
ENDURA 5500
검증됨
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
107897
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
ENDURA 5500
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
107897
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM 모델 설명
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.문서
문서 없음