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EB1000
카테고리
PVD / Sputtering개요
System configuration: Tray transport method (Load lock is option) Substrate size: φ150mm maximum (Have it of load lock;greatest φ100mm) Cathode: φ2" cathode ×3 Operation method: Auto pumping operation, manual transport/deposit operation Footprint: W1800mm×D1100mm×H1550mm (standard specification)
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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