EC7001
카테고리
PVD / Sputtering개요
System configuration: Cluster-type (EC7000 sputtering chamber ×1, EC7001 sputtering chamber ×2) Tray transport method Substrate size: φ200mm maximum Cathode: φ4" cathode ×3 (Option: φ12.5" cathode ×1, φ4" cathode ×4) Operation method: Fully automated (pumping, transport, deposition)
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
- 제품을 찾을 수 없음