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System configuration: Cluster type (up to three process chambers) C to C type Substrate size: φ200mm maximum Cathode: φ7.1" cathode (Up to 4. Varies depending on the module.) Modules: Offset rotary sputtering module (multi-cathode specification) Offset rotary and revolutionary sputtering module Etching module (preprocessing) Preheating module (preprocessing)
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검사, 보험, 감정, 물류