설명
설명 없음환경 설정
Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.OEM 모델 설명
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SIKAMA
FALCON 8500
검증됨
카테고리
Reflow Oven
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
16755
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SIKAMA
FALCON 8500
검증됨
카테고리
Reflow Oven
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
16755
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.OEM 모델 설명
미제공문서
문서 없음