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MATTSON HELIOS
  • MATTSON HELIOS
설명
Missing parts list
환경 설정
After verifying with on-site personnel, it was confirmed that "the quartz inside the chamber is still intact and usable during shutdown.
OEM 모델 설명
Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.
문서

문서 없음

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검증됨

카테고리
RTP/RTA

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

23093


웨이퍼 사이즈:

12"/300mm


빈티지:

2007


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

MATTSON

HELIOS

verified-listing-icon
검증됨
카테고리
RTP/RTA
마지막 검증일: 60일 이상 전
listing-photo-Y3x8GzuFg3-9cjoJbAQ_m5y-MtETmPY0FbSLwUKJORY-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1692/Y3x8GzuFg3-9cjoJbAQ_m5y-MtETmPY0FbSLwUKJORY/8add22058bbc4df888c94a993fa45d94_7a0a73c4702047a3bd72c7d5c275665e45005c_mw.jpeg
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

23093


웨이퍼 사이즈:

12"/300mm


빈티지:

2007


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Missing parts list
환경 설정
After verifying with on-site personnel, it was confirmed that "the quartz inside the chamber is still intact and usable during shutdown.
OEM 모델 설명
Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.
문서

문서 없음