설명
WBL LASER SAW(DAF SAW)환경 설정
환경 설정 없음OEM 모델 설명
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.문서
문서 없음
DISCO
DFL7160
검증됨
카테고리
Scribing, Cutting, Dicing
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
18639
웨이퍼 사이즈:
알 수 없음
빈티지:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기DISCO
DFL7160
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
18639
웨이퍼 사이즈:
알 수 없음
빈티지:
2012
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
WBL LASER SAW(DAF SAW)환경 설정
환경 설정 없음OEM 모델 설명
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.문서
문서 없음