설명
The laser head is new. System is working condition.환경 설정
Laser type： Laser grooving for Si Laser head： FX Laser path： BSS6OEM 모델 설명
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.문서
문서 없음
DISCO
DFL7161
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115179
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
DISCO
DFL7161
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
115179
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
The laser head is new. System is working condition.환경 설정
Laser type： Laser grooving for Si Laser head： FX Laser path： BSS6OEM 모델 설명
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.문서
문서 없음