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DISCO DFL7340
    설명
    working condition and offline
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
    문서

    문서 없음

    DISCO

    DFL7340

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    검증됨

    카테고리

    Scribing, Cutting, Dicing
    마지막 검증일: 60일 이상 전
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    61455


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2011

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    DISCO DFL7340
    DISCODFL7340Scribing, Cutting, Dicing
    빈티지: 0조건: 중고
    마지막 검증일13일 전

    DISCO

    DFL7340

    verified-listing-icon

    검증됨

    카테고리

    Scribing, Cutting, Dicing
    마지막 검증일: 60일 이상 전
    listing-photo-29b8404bcb7348309c76f2b192fed731-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49044/29b8404bcb7348309c76f2b192fed731/3ea03260a4b944ad866b4bd32807642d_85751e8a368c401fa81d84a6b85cf9151201a_mw.jpeg
    listing-photo-29b8404bcb7348309c76f2b192fed731-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49044/29b8404bcb7348309c76f2b192fed731/4905ba540b384b6fa05dfc5bc9a2cea4_9cd4068c245d4ae3b102d1352973bcc51201a_mw.jpeg
    listing-photo-29b8404bcb7348309c76f2b192fed731-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49044/29b8404bcb7348309c76f2b192fed731/0d5cbc50a9654bbab4fa2a5728612847_7d391db1197b4bd6bb927a436883bdb11201a_mw.jpeg
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    61455


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2011


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    working condition and offline
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
    문서

    문서 없음

    유사 등재물
    모두 보기
    DISCO DFL7340
    DISCO
    DFL7340
    Scribing, Cutting, Dicing빈티지: 0조건: 중고마지막 검증일: 13일 전
    DISCO DFL7340
    DISCO
    DFL7340
    Scribing, Cutting, Dicing빈티지: 0조건: 중고마지막 검증일: 15일 전
    DISCO DFL7340
    DISCO
    DFL7340
    Scribing, Cutting, Dicing빈티지: 2011조건: 중고마지막 검증일: 60일 이상 전