설명
설명 없음환경 설정
<span style="font-size: 20pt;">Disco Corporation DFL7340 Fully Automatic Laser Saw</span> Made in JapanAir: 0.5 MPa 250 L/min (ANR)Clean Air: 0.5 MPa 10 L/min (ANR)Water: 0.4 MPa or less 8 L/minEquipped with universal chuck which can be used for a maximum of 8" waferLaser Head Hours: 673 This unit was used for a qualification after its installation.Manufacturer Name: Disco Corporation Year:2017Serial Number: NH1155Model: DFL7340 Voltage:200-220 VOLTSFrequency:50/60 HERTZPhase:3 Current:10 AMPSRecommended Packaging Form: CRATE Dimensions:Standard Overall:73 x 41 x 86 IN - 4431 LBS Metric1854.20 x 1041.40 x 2184.40 mm - 2009.90 kgOEM 모델 설명
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.문서
문서 없음
DISCO
DFL7340
검증됨
카테고리
Scribing, Cutting, Dicing
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
21055
웨이퍼 사이즈:
알 수 없음
빈티지:
2017
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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유사 등재물
모두 보기DISCO
DFL7340
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
21055
웨이퍼 사이즈:
알 수 없음
빈티지:
2017
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
<span style="font-size: 20pt;">Disco Corporation DFL7340 Fully Automatic Laser Saw</span> Made in JapanAir: 0.5 MPa 250 L/min (ANR)Clean Air: 0.5 MPa 10 L/min (ANR)Water: 0.4 MPa or less 8 L/minEquipped with universal chuck which can be used for a maximum of 8" waferLaser Head Hours: 673 This unit was used for a qualification after its installation.Manufacturer Name: Disco Corporation Year:2017Serial Number: NH1155Model: DFL7340 Voltage:200-220 VOLTSFrequency:50/60 HERTZPhase:3 Current:10 AMPSRecommended Packaging Form: CRATE Dimensions:Standard Overall:73 x 41 x 86 IN - 4431 LBS Metric1854.20 x 1041.40 x 2184.40 mm - 2009.90 kgOEM 모델 설명
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.문서
문서 없음