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Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.