설명
The wavelength: 1342nm Laser current hour used: 22032.32hrs환경 설정
· Accommodates up to 12-inch wafers · Automatic handling · Auto-alignment · High speed X axis capable of 1000mm/sec · 380° rotational theta axis · Hard disk allows the user to store 1000 different device programs · Window XP based Graphical User Interface · Touch panel display · SDE01 Laser Engine · Standard IR Camera · SDE06 Laser Head · IR Camera for full Thick wafers up to 1mm (replaces standard IR camera) · 25 Character Recipe name · SECS GEM · Additional Host Monitor, keyboard stand, and cable port addition · Wafer ID reader · Clean Unit Hepa Processing Section · Clean Unit Hepa Transfer Section · Frame Handling and Wafer Handling Option · Vacuum Retention and SG140154-0. · SD Through Tape in Manual Mode. Wafer transfer (Standard specification) : ①The workpiece is withdrawn from the cassette by the wafer pick and transferred to the load table ②The workpiece is transferred to the chuck table by the rotation arm → laser processing ③The workpiece is transferred to the unload table by the rotation arm ④The workpiece is returned to the cassette by the frame pickOEM 모델 설명
The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.문서
문서 없음
DISCO
DFL7361
검증됨
카테고리
Scribing, Cutting, Dicing
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
31238
웨이퍼 사이즈:
12"/300mm
빈티지:
2017
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFL7361
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
31238
웨이퍼 사이즈:
12"/300mm
빈티지:
2017
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
The wavelength: 1342nm Laser current hour used: 22032.32hrs환경 설정
· Accommodates up to 12-inch wafers · Automatic handling · Auto-alignment · High speed X axis capable of 1000mm/sec · 380° rotational theta axis · Hard disk allows the user to store 1000 different device programs · Window XP based Graphical User Interface · Touch panel display · SDE01 Laser Engine · Standard IR Camera · SDE06 Laser Head · IR Camera for full Thick wafers up to 1mm (replaces standard IR camera) · 25 Character Recipe name · SECS GEM · Additional Host Monitor, keyboard stand, and cable port addition · Wafer ID reader · Clean Unit Hepa Processing Section · Clean Unit Hepa Transfer Section · Frame Handling and Wafer Handling Option · Vacuum Retention and SG140154-0. · SD Through Tape in Manual Mode. Wafer transfer (Standard specification) : ①The workpiece is withdrawn from the cassette by the wafer pick and transferred to the load table ②The workpiece is transferred to the chuck table by the rotation arm → laser processing ③The workpiece is transferred to the unload table by the rotation arm ④The workpiece is returned to the cassette by the frame pickOEM 모델 설명
The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.문서
문서 없음