The Atlas III+ is a platform for advanced process control metrology. It has been qualified at multiple memory and foundry/logic device manufacturers, each utilizing the company’s proprietary analysis software including NanoDiffract® and SpectraProbe™. The Atlas III+ combines spectroscopic ellipsometry (SE) with full Mueller Matrix capability and broadband reflectometry (SR) to provide metrology performance while also increasing productivity on the most demanding devices, both in development and high-volume production. The Atlas III+ is the latest in the family of combination SE/SR systems for advanced fab metrology and process control, and is an automated system supporting advanced OCD and thin-film metrology with proprietary ellipsometry and reflectometry technologies. The Atlas III+ delivers best-in-class precision and repeatability at a faster overall system throughput, supporting a broad variety of process control applications. When combined with NanoDiffract, the Atlas III+ enables high-fidelity metrology on the most complex three-dimensional structures. When utilizing SpectraProbe, the Atlas III+ provides unique insight into on-device and in-die control for advanced yield learning and process optimization. Overall, the Atlas III+ is a powerful tool for advanced process control metrology.

ONTO / NANOMETRICS / ACCENT / BIO-RAD

ATLAS III+

The Atlas offers high-accuracy, high-precision metrology for wafer characterization and can be configured for 150mm to 300mm wafer sizes or 6-inch masks and reticles. The Altas XP is the newest product line in the Atlas family and addresses thin film and OCD for the 45nm and 32nm nodes.

ATLAS XP

The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab. The sensitivity of Atlas V metrology enables these critical dimensions to be measured with high accuracy and sensitivity, extending the capability of optical solutions for generations of devices and eliminating the need for other slower process control techniques.
The Atlas V technology enables the performance needed for customers’ development of GAA/3D NAND/DRAM and is over 100 times faster than X-ray solutions for these structures. 

ATLAS V

The Atlas II is an advanced 300mm metrology system from Nanometrics, designed for high-performance process control metrology. It incorporates innovations in optical components, precision wafer positioning, and new software analysis to enable measurements of the smallest semiconductor design features, including complex device structures at 1x nm technology nodes. The system provides unprecedented stability in focus performance, allowing precise and repeatable measurements of critical device features. It is capable of on-device measurement, eliminating the need for scribe-line marks and enabling direct and reliable process control of device manufacturing. The Atlas II also offers a doubling of wafer throughput and significant improvement in wafer positioning precision, lowering the system’s cost of ownership. It is compatible with Nanometrics’ Lynx cluster metrology platform and can be configured with Spectroscopic reflectometer (SR) and Spectroscopic ellipsometer (SE) metrology modules, with optional additions such as NanoCD Suite for OCD and wafer stress/bow.

ATLAS II

The Atlas III, Atlas II+, and Atlas XP/Atlas XP+ line of high-performance metrology systems providing optical critical dimension (“OCD”®), thin film metrology and wafer stress for transistor and interconnect metrology applications.


ATLAS III

The Atlas-M further extends the versatility of this 300mm platform to provide fully automated mask and reticle measurements. The system is capable of housing up to five metrology technologies including polarized, normal incidence spectroscopic ellipsometry for linewidth profile and critical dimensions, spectroscopic reflectometry for films and film stacks, UV and deep UV spectroscopic ellipsometry for ultra-thin films and film characterization, diffraction-based overlay technology for layer-to-layer registration measurement, and film stress/wafer bow measurements. The Atlas offers high accuracy, high precision metrology for wafer characterization and can be configured for 200mm and 300mm wafer sizes or 6-inch masks and reticles.

ATLAS-M

ATLAS XPM

ATLAS XP+

The NanoSpec 6100 is a tabletop film analysis system that provides fast and low-cost measurement capabilities for thin film metrology. It uses non-contact spectroscopic reflectometry to measure sites as small as 10µm in diameter on production wafers and can measure wafer substrates in the size range of 75 to 200mm and photomasks from 5 to 9 inches square. The system can measure film thickness in the range of 200Å - 20µm with the visible light source and 25Å - 20µm with an optional UV light source. The upper thickness range can be extended to 70µm with the thick film option. The system also has a motorized, precision x-y sample stage with a resolution of better than 1µm and a high-resolution color graphics display that provides contour and 3D film thickness mapping.

NANOSPEC 6100

The Nanometrics Atlas™ is an advanced metrology system that can accommodate both 200 or 300 mm wafer metrology. It features a dual-arm robot, high-precision stage, and high-speed focus system. The system also boasts robust pattern recognition, improved thickness reproducibility, and superior throughput. The N2000 software interface and advanced automation are compliant with industry standards, and the NanoNet feature provides system-to-system matching and seamless recipe transferability. The Atlas can be configured with a combination of metrology modules, including Spectroscopic Reflectometer (SR), Spectroscopic Ellipsometer (SE), Optical Critical Dimension (OCD), Diffraction Based Overlay (DBO), and Wafer Stress/Bow.

ATLAS

The NanoSpec 8000X is a versatile tool designed for the automated measurement of wafers ranging in size from 75mm to 200mm. It comes with a standard mechanical interface and can be equipped with mini-environment enclosures, making it suitable for use in ultra-clean manufacturing facilities. Additionally, the 8000X can be configured to handle substrates used in the magnetic recording head industry. With these features, the NanoSpec 8000X is a reliable and adaptable solution for a variety of wafer measurement needs.

NANOSPEC 8000X

The Atlas II+ is an advanced Optical CD (OCD) Metrology System developed by Nanometrics. It is designed for high-performance process control metrology and incorporates innovations in optical components, precision wafer positioning, and new software analysis. The system is capable of measuring the smallest semiconductor design features, including complex device structures at 1x nm technology nodes. It also provides unprecedented stability in focus performance and can measure a range of structures, including asymmetric spacers and 3-D gratings. The Atlas II+ is compatible with Nanometrics’ Lynx cluster metrology platform and can be configured with spectroscopic reflectometer (SR) and spectroscopic ellipsometer (SE) metrology modules. It also offers a doubling of wafer throughput and an order of magnitude improvement in wafer positioning precision, enabling significant increases in data volume and lowering the system’s cost of ownership. Additionally, it can be optionally equipped with NanoCD Suite for OCD and wafer stress/bow measurement capabilities.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

ONTO / NANOMETRICS / ACCENT / BIO-RAD

개요

활성 등재물

총 제품 수

서비스

상위 ONTO / NANOMETRICS / ACCENT / BIO-RAD Thin Film

ATLAS XP

ATLAS V

ATLAS II

ATLAS III

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.

모든 ONTO / NANOMETRICS / ACCENT / BIO-RAD Thin Film