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SMARTVIEW NT
카테고리
Wafer Bonders개요
The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacks for leading-edge technologies. SmartView technology can be combined with the GEMINI wafer bonding systems for subsequent permanent bonding in a fully automated platform. Wafer Bonder
활성 등재물
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서비스
검사, 보험, 감정, 물류
상위 등재물
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