GEMINI FB
카테고리
Wafer Bonders개요
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.
활성 등재물
1
서비스
검사, 보험, 감정, 물류