The tool is in crate.
condition: deinstalled last year and not in crates.
vintage:2006
Location: in my warehouse
Date of last maintenance: 2019
Price: $200K USD

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVGroup (EVG)

The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility.

EVG520IS

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EVGroup (EVG)

EVG520IS

Wafer Bonders

유사 등재물

EVGroup (EVG)

EVG520IS

EVGroup (EVG)

EVG520IS

EVG520IS

Wafer Bonders

유사 등재물

EVGroup (EVG)

EVG520IS

EVGroup (EVG)

EVG520IS